Author: Steven Kalisn

  • Professional Recycling Services for AMD XC5VFX200TFFG1738 and Electronic Components

    NEEDIC is a specialized service provider focused on recycling integrated circuits (ICs) and a wide range of electronic components. We are committed to delivering secure, transparent, and highly efficient recycling solutions for factories, distributors, R&D institutions, and repair centers. Whether you have excess production material, test rejects, expired components, or entire batches of obsolete BOM…

  • Ultimate Guide to High Bandwidth Memory

    What Is HBM? The Architecture Behind High Bandwidth Memory High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM architecture connected through Through-Silicon Vias (TSVs) – vertical electrical connections that link multiple DRAM layers together. These stacks sit atop a silicon interposer, placed very close to the processor, reducing the distance data must travel and dramatically…

  • The Nexperia Chip Crisis

    The Current Situation: Dutch Government Intervention and Chinese Response In October 2025, the Dutch government took control of Nexperia under emergency powers, citing national security and governance concerns related to its Chinese parent company, Wingtech Technology. The move prevents Nexperia from making major operational changes, including shifting assets or appointing new leadership, without approval from…